Author:
McGrath Mark P.,Aihara Kunia,Chen Morgan J.,Chen Cheng,Pham Anh-Vu
Reference33 articles.
1. Nicholson, D.: Low return loss DC to 60 GHz SMT Packages with Performance Verification by Precision 50 ohm load. Proceedings of 35th European Microwave Conference Paris, France. October 2005.
2. Fujii, K., Morkner, H.: A 6-30 GHz Image-rejection Distributed Resistive MMIC Mixer in a Low Cost Surface Mount Package. IEEE MTT-S International Microwave Symposium Digest, Long Beach, CA. June 2005, 37–40.
3. Fujii, K., Morkner, H.: Two Novel Broadband MMIC Amplifiers in SMT Package for 1 to 40 GHz Low Cost Applications. 35th European Microwave Conference, Paris, France. October 2005.
4. Aboush, Z., Benedikt, J., Priday, J., Tasker, R. J.: DC-50 GHz Low Loss Thermally Enhanced Low Cost LCP Package Process Utilizing Micro Via Technology. IEEE MTT-S International Microwave Symposium Digest, San Francisco, CA. June 2006, 961–964.
5. Kanno, H., Ogura, H., Takahashi, K.: Surface-Mountable Liquid Crystal Polymer Package with Vertical Via Transition Compensating Wire Inductance up to v-band. IEEE MTT-S International Microwave Symposium Digest, Philadelphia, PA. June 2003, 1159–1162.
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献