Publisher
Springer Berlin Heidelberg
Reference109 articles.
1. Robertson, I.D., Lucyszyn, S. (eds.): RFIC and MMIC Design and Technology. IEE Press (2001)
2. Liu, D., Pfeiffer, U., Grzyb, J., Gaucher, B. (eds.): Advanced Millimeter-wave Technologies: Antennas, Packaging and Circuits. Wiley (2009)
3. Harper, C.A.: Electronic Packaging and Interconnection Handbook. McGraw-Hill (2005)
4. Johansson, C.: High Frequency Electronic Packaging and Components: Characterization, Simulation, Materials and Processing, Linkøping University (2007)
5. Kuang, K., Kim, F., Gahill, S.S. (eds.): RF and Microwave Microelectronics Packaging. Springer (2009)