Author:
Xie Yuan,Cong Jason,Sapatnekar Sachin
Cited by
30 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. The Development and Progress of Multi-Physics Simulation Design for TSV-Based 3D Integrated System;Symmetry;2023-02-04
2. Effective Routing Algorithm for Thermal Management in Vertically-
Partially-Connected 3D-network on Chip;Recent Advances in Electrical & Electronic Engineering (Formerly Recent Patents on Electrical & Electronic Engineering);2022-12
3. Timing Closure;VLSI Physical Design: From Graph Partitioning to Timing Closure;2022
4. Collaborative thermal- and traffic-aware adaptive routing scheme for 3D network-on-chip systems;IEICE Electronics Express;2021-02-25
5. Split Manufacturing Methods;Split Manufacturing of Integrated Circuits for Hardware Security and Trust;2021