Lead (Pb)-free solders for electronic packaging-Reference-Cited by-同舟云学术

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Lead (Pb)-free solders for electronic packaging

Published:1994-08 Issue:8 Volume:23 Page:701-707
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:JEM

Author:

Kang Sung K.,Sarkhel Amit K.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/BF02651362.pdf

Reference58 articles.

1. Binary Alloy Phase Diagrams, ed. T.B. Massalski, (Materials Park, OH: American Society for Metals, 1987), p. 1848.

2. B. Roos-Kozel,Surface Mount Technology Tech. Mono. 6984- 002 (Silver Spring, MD: ISHM, 1986), p.115.

3. D. Romm and N. McLellan,Surface Mount Tech. Jan. 35 (1993).

4. D. Heller, J. Leonard and J. Neville,Elec. Packg. & Prod. Dec. 58 (1992).

5. M. Warwick,Circuits Assembly June, 60 (1992).

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