Author:
Shen Tzu-Hao,Cheng Kai-Wen,Wang Hung,Chen Ping-Hsuan,Chao Jui-Lin,Huang Jyung-Yong,Wang Chang-Meng,Wu Albert T.
Funder
Ministry of Science and Technology, Taiwan
National Science and Technology Council
Subject
General Materials Science
Reference35 articles.
1. Low-temperature solders;Mei;Hewlett Packard J.,1996
2. High lead solder (over 85%) solder in the electronics industry: RoHS exemptions and alternatives;Menon;J. Mater. Sci. Mater. Electron.,2015
3. Constitutive behaviour of lead-free solders vs. lead-containing solders-experiments on bulk specimens and flip-chip joints;Wiese,2001
4. Lead (Pb)-free solders for electronic packaging;Kang;J. Electron. Mater.,1994
5. SiC-die-attachment for high temperature applications, Materials science forum;Heuck;Trans Tech Publ,2010
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