Creep in chipboard-Reference-Cited by-同舟云学术

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Creep in chipboard

Published:1991-07 Issue:5 Volume:25 Page:
ISSN:0043-7719
Container-title:Wood Science and Technology
language:en
Short-container-title:Wood Sci.Technol.

Author:

Dinwoodie J.M.,Higgins J.-A.,Paxton B.H.,Robson D.J.

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Plant Science,General Materials Science,Forestry

Link

http://link.springer.com/content/pdf/10.1007/BF00226178.pdf

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Experimental Study on Bending Creep Behavior of Modified Fast-Grown Poplar Wood in Uncontrolled Condition;Advanced Materials Research;2012-02

2. Flexural creep behavior of sandwich panels containing Kraft paper honeycomb core and wood composite skins;Materials Science and Engineering: A;2011-06

3. Elastic properties of adhesive polymers. II. Polymer films and bond lines by means of nanoindentation;Journal of Applied Polymer Science;2006

4. Fatigue in wood-based panels. Part 1: The strength variability and fatigue performance of OSB, chipboard and MDF;Wood Science and Technology;2002-06-01

5. Einsatzmöglichkeiten von Holzwerkstoffen;Holzwerkstoffe und Leime;2002

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