Reflow Thermal Recipe Segment Optimization Model Based on Artificial Neural Network Approach
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Publisher
Springer International Publishing
Link
https://link.springer.com/content/pdf/10.1007/978-3-031-17629-6_6
Reference9 articles.
1. Tsai, T.N.: Modeling and optimization of stencil printing operations: a comparison study. Comput. Ind. Eng. 54(3), 374–389 (2008)
2. Li, Y., He, J., Won, D., Yoon, S.W.: Non-contact reflow oven thermal profile prediction based on artificial neural network. IEEE Trans. Compon. Packag. Manuf. Technol. 11(12), 2229–2237 (2021)
3. Illés, B.: Distribution of the heat transfer coefficient in convection reflow oven. Appl. Thermal Eng. 30(13), 1523–1530 (2010)
4. Tsai, T.N.: Thermal parameters optimization of a reflow soldering profile in printed circuit board assembly: a comparative study. Appl. Soft Comput. 2601–2613 (2012)
5. Ma, G., Huang, X., Liu, S.: Heat transfer modeling and oven temperature curve optimization of integrated circuit board reflow soldering. IEEE Access 9, 141876–141889 (2021)
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1. Reflow Oven Recipe Optimization Approaches Based on Data-Driven Simulation;Systems Collaboration and Integration;2023
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