NANO-CHIPS 2030
Author:
Publisher
Springer International Publishing
Link
http://link.springer.com/content/pdf/10.1007/978-3-030-18338-7.pdf
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Real scenario analysis and prevention of functional safety faults of autonomous driving perception chips;Third International Conference on Control and Intelligent Robotics (ICCIR 2023);2023-12-01
2. Automated In-Situ Monitoring for Variability-Resilient and Energy-Efficient Digital Circuits Demonstrated on a Viterbi Decoder in 22-nm CMOS;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2023-09
3. Bottom-Up and Top-Down Approaches for the Design of Neuromorphic Processing Systems: Tradeoffs and Synergies Between Natural and Artificial Intelligence;Proceedings of the IEEE;2023-06
4. IoT-Based Compressive Sensing for Real-World Infrastructural Monitoring Application;ICC 2023 - IEEE International Conference on Communications;2023-05-28
5. Investigate the heat conduction between film and substrate during sputtering process by multi-layer structure NiCr/NiSi film thermocouples;Journal of Alloys and Compounds;2023-04
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