Memristive/CMOS Devices for Neuromorphic Applications
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Publisher
Springer International Publishing
Link
https://link.springer.com/content/pdf/10.1007/978-3-030-79827-7_32
Reference200 articles.
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4. Kuhn, K.J.: Considerations for ultimate CMOS scaling. IEEE Trans. Electron Devices. 59(7), 1813–1828 (2012). https://doi.org/10.1109/TED.2012.2193129
5. Vinet, M., et al.: Monolithic 3D integration: A powerful alternative to classical 2D scaling. In: 2014 SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), pp. 1–3 (2014). https://doi.org/10.1109/S3S.2014.7028194
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