Dynamic Stresses in the Adhesive Joint. The Goland-Reissner Model
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Publisher
Springer Nature Switzerland
Link
https://link.springer.com/content/pdf/10.1007/978-3-031-40628-7_38
Reference30 articles.
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2. Wong, E.H., Liu, J.: Interface and interconnection stresses in electronic assemblies – a critical review of analytical solutions. Microelectron. Reliab. 79, 206–220 (2017). https://doi.org/10.1016/j.microrel.2017.03.010
3. Kurennov, S.S.: An approximate two-dimensional model of adhesive joints. analytical solution. Mech. Compos. Mater. 50(1), 105–114 (2014). https://doi.org/10.1007/s11029-014-9397-z
4. Kurennov, S.S., Barakhov, K.P.: The stressed state of the double-layer rectangular plate under shift. The simplified two-dimensional model. PNRPU Mech. Bull. 3, 166–174 (2019). https://doi.org/10.15593/perm.mech/2019.3.16
5. Pugno, N., Carpinteri, A.: Tubular adhesive joints under axial load. J. Appl. Mech. 70(6), 832–836 (2003). https://doi.org/10.1115/1.1604835
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