Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference60 articles.
1. The tension of metallic films deposited by electrolysis;Stoney;Proc. R. Soc. Lond.,1909
2. Analysis of bi-metal thermostats;Timoshenko;J. Optical Soc. Am.,1925
3. Die NietKraftverteilung in Zugbeanspruchten Nietverbindungen mit Konstentan Laschenquerschnitten;Volkersen;Luftfahrtforchung,1938
4. Stresses in cemented joints;Goland;ASME J. Appl. Mech.,1944
5. Thermal stress and fracture in shear-constrained semiconductor device structures;Taylor;IRE Trans. Electron Devices,1962
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