Experimental Investigations of Phase Change Materials (PCM) for Electronic Cooling Application Using Heat Sinks
Author:
Publisher
Springer Nature Switzerland
Link
https://link.springer.com/content/pdf/10.1007/978-3-031-66609-4_33
Reference13 articles.
1. Ali, H.M.: Thermal management of electronics: an experimental analysis of triangular, rectangular and circular pin-fin heat sinks for various PCMs. Int. J. Heat Mass Transf. 123, 272–284 (2018)
2. Arshad, A.: Thermal performance of phase change material (PCM) based pin-finned heat sinks for electronics devices: effect of pin thickness and PCM volume fraction. Appl. Therm. Eng. 112, 143–155 (2017)
3. Arshad, A.: Experimental investigation of PCM based round pin-fin heat sinks for thermal management of electronics: effect of pin-fin diameter. Int. J. Heat Mass Transf. 117, 861–872 (2018)
4. Ashraf, M.J.: Experimental passive electronics cooling: parametric investigation of pin-fin geometries and efficient phase change materials. Int. J. Heat Mass Transf. 115, 251–263 (2017)
5. Baby, R., Balaji, C.: Experimental investigations on phase change material based finned heat sinks for electronic equipment cooling. Int. J. Heat Mass Transf. 55(5–6), 1642–1649 (2012)
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