Author:
Solovjev D. S.,Solovjeva I. A.,Konkina V. V.
Publisher
Springer International Publishing
Reference23 articles.
1. Gamburg YD, Zangari G (2011) Electrodeposition of alloys. Theory and practice of metal electrodeposition. Springer, New York, pp 205–232
2. Tan YJ, Lim KY (2003) Understanding and improving the uniformity of electrodeposition. Surf Coat Tech 167(2–3):255–262. https://doi.org/10.1016/s0257-8972(02)00916-7
3. Volgin VM, Lyubimov VV, Gnidina IV, Kabanova TB, Davydov AD (2017) Effect of anode shape on uniformity of electrodeposition onto resistive substrates. Electrochim Acta 230:382–390. https://doi.org/10.1016/j.electacta.2017.02.015
4. Garich H, Shimpalee S, Lilavivat V, Snyder S, Taylor EJ (2016) Non-traditional cell geometry for improved copper plating uniformity. J Electrochem Soc 163(8):216–222. https://doi.org/10.1149/2.0491608jes
5. Parate DS, Sabitha R, Pushpavanam M, John S (1996) Studies on bipolar electrode for preferential deposit build on intricate shaped article. Bull Electrochem 12(05):294–296
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