Author:
Wang Peng,Gao Zeng,Niu Jitai
Publisher
Springer Science and Business Media LLC
Subject
General Materials Science,General Chemistry
Reference29 articles.
1. M. Guo, J. Liu, Y. Li, Microstructure and properties of SiCp/Al electronic packaging shell produced by liquid–solid separation. Trans. Nonferrous Metals Soc. China 24, 1039–1045 (2014)
2. G. Wu, Q. Zhang, G. Chen, L. Jiang, Z. Xiu, Properties of high reinforcement-content aluminum matrix composite for electronic packages. J. Mater. Sci.: Mater. Electron. 14, 9–12 (2003)
3. P. Shen, Y. Wang, L. Ren, S. Li, Y. Liu, Q. Jiang, Influence of SiC surface polarity on the wettability and reactivity in an Al/SiC system. Appl. Surf. Sci. 355, 930–938 (2015)
4. D. Storjohann, O.M. Barabash, S.A. David, P.S. Sklad, E.E. Bloom, S.S. Babu, Fusion and friction stir welding of aluminum-metal-matrix composites. Mater. Sci. Eng. A Struct. 36, 3237–3247 (2005)
5. A. Urena, M.D. Escalera, L. Gil, Influence of interface reactions on fracture mechanisms in TIG arc-welded aluminium matrix composites. Compos. Sci. Technol. 60, 613–622 (2000)
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