Author:
Nordin I. H. W.,Okamoto Y.,Okada A.,Jiang H.,Sakagawa T.
Funder
Japan Society for the Promotion of Science
Publisher
Springer Science and Business Media LLC
Subject
General Materials Science,General Chemistry
Reference20 articles.
1. A.G. Darrin, R. Osiander, in MEMS Packaging Materials, ed. by R. Ghodssi, P. Lin (Springer, Boston, 2011)
2. S.A. Audep, M.E. Katrina, International conference on Solid-state Sensors and Actuators (Chicago, 1997), pp. 287–289
3. J. Baborowski, A. Pezous, D.G. Spinola, R. Jose James, R. Ziltener, C. Muller, M.A. Dubois, Proced. Chem. 1(1), 153538 (2009)
4. M. Chiao, Y.T. Cheng, L. Lin, in Introduction to MEMS Packaging, ed. by Z. Zhou, Z. Wang, L. Lin (Springer, Berlin, 2012), pp. 415–446
5. R.L. Smith, S.D. Collins, IEEE Trans. on Electron Devices 35, 787–792 (1988)
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