1. A. Pouydebasque, B. Dumont, S. Denorme, F. Wacquant, M. Bidaud, C. Laviron, A. Halimaoui, C. Chaton, J.D. Chapon, P. Gouraud, F. Leverd, H. Bernard, S. Warrick, D. Delille, K. Romanjek, R. Gwoziecki, N. Planes, S. Vadot, I. Pouilloux, F. Arnaud, F. Boeuf, T. Skotnicki, in Tech. Dig. Int. Electron Devices Meet (2005), p. 663
2. M. Bidaud, H. Bono, C. Chaton, B. Dumont, V. Huard, P. Morin, L. Proencamota, R. Ranica, G. Ribes, in Proc. 15th IEEE Int. Conf. Advanced Thermal Processing of Semiconductors (2007), p. 251
3. T. Yamamoto, T. Kubo, T. Sugekawa, L. Feng, Y. Wang, M. Kase, J. Electrochem. Soc. 153, 598 (2006)
4. T. Feudel, M. Horstmann, L. Herrmann, M. Herden, M. Gerhardt, D. Greenlaw, P. Fisher, J. Kluth, in Proc. 14th IEEE Int. Conf. Advanced Thermal Processing of Semiconductors (2006), p. 73
5. A. Colin, P. Morin, F. Cacho, H. Bono, R. Beneyton, M. Bidaud, D. Mathiot, E. Fogarassy, Mater. Sci. Eng. B 154–155, 31 (2008)