Ablation and cutting of planar silicon devices using femtosecond laser pulses-Reference-Cited by-同舟云学术

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Ablation and cutting of planar silicon devices using femtosecond laser pulses

Published:2003-07 Issue:2 Volume:77 Page:237-242
ISSN:0947-8396
Container-title:Applied Physics A
language:en
Short-container-title:Appl Phys A

Author:

Bärsch N.,Körber K.,Ostendorf A.,Tönshoff K.H.

Publisher

Springer Science and Business Media LLC

Subject

General Materials Science,General Chemistry

Link

http://link.springer.com/content/pdf/10.1007/s00339-003-2118-4.pdf

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