Author:
Han Xuesong,Hu Yuanzhong,Yu Siyuan
Publisher
Springer Science and Business Media LLC
Subject
General Materials Science,General Chemistry
Reference24 articles.
1. F.W. Preston, The theory and design of plate glass polishing machine, J. Soc. Glass. Tech. 11(44), 214–256 (1927)
2. V.H. Nguyen, F.G. Shi, Modeling of the removal rate in chemical mechanical polishing, Proc. SPIE Int. Soc. Opt. Eng. 4181, 161–167 (2000)
3. G. Fu, A. Chandra, S. Guha , A plasticity-based model of material removal in chemical-mechanical polishing (CMP), IEEE Trans. Semicond. Manuf. 14(4), 406–417 (2001)
4. J.F. Luo, D.A. Dornfeld, Effects of abrasive size distribution in chemical mechanical planarization: modeling and verification, IEEE Trans. Semicond. Manuf. 16(3), 469–476 (2003)
5. S.R. Runnels, I. Kim, J. Schleuter , Modeling tool for chemical-mechanical polishing design and evaluation, IEEE Trans. Semicond. Manuf. 11(3), 501–510 (1998)
Cited by
60 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献