Thermal, dielectric and antimicrobial properties of polystyrene-assisted/ITO:Cu nanocomposites-Reference-Cited by-同舟云学术

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Thermal, dielectric and antimicrobial properties of polystyrene-assisted/ITO:Cu nanocomposites

Published:2019-01 Issue:1 Volume:125 Page:
ISSN:0947-8396
Container-title:Applied Physics A
language:en
Short-container-title:Appl. Phys. A

Author:

El Nahrawy Amany. M.,Hammad Ali B. Abou,Youssef Ahmed M.,Mansour A. M.,Othman Abdelmageed M.

Publisher

Springer Science and Business Media LLC

Subject

General Materials Science,General Chemistry

Link

http://link.springer.com/article/10.1007/s00339-018-2351-5/fulltext.html

Reference49 articles.

1. A. Klein, C. Körber, A. Wachau, F. Säuberlich, Y. Gassenbauer, S.P. Harvey, D.E. Proffit, T.O. Mason, Materials (Basel) 3, 4892–4914 (2010)

2. C. Huh, B.K. Kim, C.-G. Ahn, C.-J. Choi, S.-H. Kim, Appl. Phys. Lett. 105, 031108 (2014)

3. M.K. Fung, Y.C. Sun, A.M.C. Ng, X.Y. Chen, K.K. Wong, A.B. Djurišíc, W.K. Chan, Appl. Phys. A Mater. Sci. Process. 104, 1075–1080 (2011)

4. Q. Wan, M. Wei, D. Zhi, J.L. MacManus-Driscoll, M.G. Blamire, Adv. Mater. 18, 234–238 (2006)

5. S. Besbes, H. Ben Ouada, J. Davenas, L. Ponsonnet, N. Jaffrezic, P. Alcouffe, Mater. Sci. Eng. C 26, 505–510 (2006)

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