Controlled electromigration and oxidation of free-standing copper wires-Reference-Cited by-同舟云学术

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Controlled electromigration and oxidation of free-standing copper wires

Published:2016-12 Issue:12 Volume:122 Page:
ISSN:0947-8396
Container-title:Applied Physics A
language:en
Short-container-title:Appl. Phys. A

Author:

Hauser J. S.,Schwichtenberg J.,Marz M.,Sürgers C.,Seiler A.,Gerhards U.,Messerschmidt F.,Hensel A.,Dittmeyer R.,Löhneysen H. v.,Hoffmann-Vogel R.

Funder

European Research Council

Ministerium für Wissenschaft, Forschung und Kunst Baden-Württemberg

Alexander von Humboldt-Stiftung

Publisher

Springer Science and Business Media LLC

Subject

General Materials Science,General Chemistry

Link

http://link.springer.com/content/pdf/10.1007/s00339-016-0600-z.pdf

Reference27 articles.

1. J. Black, IEEE Trans. Electron Dev. 16, 338 (1969)

2. C.S. Hau-Riege, Microelectron. Reliab. 44, 195 (2004)

3. D.R. Strachan, D.E. Smith, D.E. Johnston, T.H. Park, M.J. Therien, D.A. Bonnell, A.T. Johnson, Appl. Phys. Lett. 86(4), 043109 (2005)

4. R. Hoffmann, D. Weissenberger, J. Hawecker, D. Stöffler, Appl. Phys. Lett. 93(4), 043118 (2008)

5. H. Park, J. Park, A.K.L. Lim, E.H. Anderson, A.P. Alivisatos, P.L. McEuen, Nature 407(6800), 57 (2000)

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