Effects of post-reflow cooling rate and thermal aging on growth behavior of interfacial intermetallic compound between SAC305 solder and Cu substrate
Author:
Publisher
Springer Science and Business Media LLC
Subject
General Materials Science,General Chemistry
Link
http://link.springer.com/content/pdf/10.1007/s00339-016-9893-1.pdf
Reference23 articles.
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3. L. Zhang, L. Sun, Y.H. Guo, Microstructures and properties of Sn58Bi, Sn35Bi0.3Ag, Sn35Bi1.0Ag solder and solder joints. J. Mater. Sci. Mater. Electron. 26, 7629–7634 (2015)
4. X.W. Hu, Q. Huang, Y.L. Li, Y. Liu, Z.X. Min, A study on the interfacial reaction of Sn58Bi/Cu soldered joints under various cooling and aging conditions. J. Mater. Sci. Mater. Electron. 26, 5140–5151 (2015)
5. Q.K. Zhang, W.M. Long, X.Q. Yu, Y.Y. Pei, P.X. Qiao, Effects of Ga addition on microstructure and properties of Sn–Ag–Cu/Cu solder joints. J. Alloys Compd. 622, 973–978 (2015)
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