Tensile properties and morphology of pyrophosphate copper deposits-Reference-Cited by-同舟云学术

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Tensile properties and morphology of pyrophosphate copper deposits

Published:1982-09 Issue:5 Volume:12 Page:619-626
ISSN:0021-891X
Container-title:Journal of Applied Electrochemistry
language:en
Short-container-title:J Appl Electrochem

Author:

Ogden C.,Tench D.,White J.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrochemistry,General Chemical Engineering

Link

http://link.springer.com/content/pdf/10.1007/BF00614991.pdf

Reference16 articles.

1. J. K. Hagge, in ?Proceedings of the Printed Circuit World Expo '80?, Pasadena, CA, May 1980.

2. C. Ogden and D. Tench,Plating Surf. Finish 66 (1979) 30.

3. C. Ogden, D. Tench and J. White,Plating Surf. Finish. 67 (1980) 50.

4. C. Ogden and D. Tench,Electrochem. Soc. 128 (1981) 539.

5. R. Haak, C. Ogden and D. Tench,J. Appl. Electrochem. 11 (1981) 771.

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1. Tin and Tin Alloys for Lead-Free Solder;Modern Electroplating;2011-02-24

2. Electrodeposition of Copper;Modern Electroplating;2011-02-24

3. Wear resistance of copper EDM tool electrode electroformed from copper sulfate baths and pyrophosphate baths;The International Journal of Advanced Manufacturing Technology;2010-02-21

4. Electrodeposition of palladium on the copper lead frame: Electrode reaction characteristics and the effects of primary additives;Korean Journal of Chemical Engineering;2007-11

5. Physical properties of pulsed current copper electrodeposits;Journal of Materials Science;1995

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