Residual Stresses in Ultrasonic-Assisted Laser Sintered Grinding Diamond Materials
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanics of Materials
Link
http://link.springer.com/content/pdf/10.1007/s11223-019-00105-5.pdf
Reference22 articles.
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3. Y. J. Lu, J. Xie, and X. H. Si, “Study on micro-topographical removals of diamond grain and metal bond in dry electro-contact discharge dressing of coarse diamond grinding wheel,” Int. J. Mach. Tool. Manu., 88, 118–130 (2015).
4. J. Kundrak, V. Fedorovich, A. P. Markopoulos, et al., “Diamond grinding wheels production study with the use of the finite element method,” J. Adv. Res., 7, No. 6, 1057–1064 (2016).
5. W. Ding, B. Linke, Y. Zhu, et al., “Review on monolayer CBN superabrasive wheels for grinding metallic materials,” Chinese J. Aeronaut., 30, No. 1, 109–134 (2017).
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