Author:
Sun F. Q.,Liu J. C.,Cao Z. Q.,Li X. Y.,Jiang T. M.
Publisher
Springer Science and Business Media LLC
Reference16 articles.
1. Ali A. Ismail, “On designing constant-stress partially accelerated life tests under time-censoring,” Strength Mater., 46, No. 1, 132–139 (2014).
2. H. Cui, “Accelerated temperature cycle test and Coffin–Manson model for electronic packaging,” in: Proc. Annual Reliability and Maintainability Symp. (Jan. 24–27, 2005, Alexandria, VA, USA), IEEE (2005), pp. 556–560.
3. S. Z. Li, X .Y. Li, T. M. Jiang, and J. J. Liu, “Application of temperature cycle based ALT technology in electronic products,” Equip. Environ. Eng., 6, No. 6, 73–77 (2009).
4. S. S. Zhao, Y. X. Chen, and Y. N. Jia, “Design and assessment of accelerated life testing based on modified Coffin–Manson model,” Struct. Environ. Eng., 40, No. 4, 52–58 (2013).
5. K. C. Norris and A. H. Landzberg, “Reliability of controlled collapse interconnections,” IBM J. Res. Develop., 13, 266–271 (1969).
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