Effect of Minor Titanium Addition on Copper/Diamond Composites Prepared by Hot Forging-Reference-Cited by-同舟云学术

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Effect of Minor Titanium Addition on Copper/Diamond Composites Prepared by Hot Forging

Published:2018-03-15 Issue:10 Volume:70 Page:2243-2248
ISSN:1047-4838
Container-title:JOM
language:en
Short-container-title:JOM

Author:

Yang Fei^ORCID,Sun Wei,Singh Ajit,Bolzoni Leandro

Funder

US Air Force, Asian Office of Aerospace R&D

University of Waikato, New Zealand

Publisher

Springer Science and Business Media LLC

Subject

General Engineering,General Materials Science

Link

http://link.springer.com/article/10.1007/s11837-018-2815-2/fulltext.html

Reference20 articles.

1. T. Schubert, A. Brendel, K. Schmid, T. Koeck, L. Ciupinski, W. Zielinski, T. Weissgarber, and B. Kieback, Compos. Part A Appl. Sci. Manuf. 38, 2398 (2007).

2. J.M. Molina, M. Rheme, J. Carron, and L. Weber, Scr. Mater. 58, 393 (2008).

3. R. Arpon, J.M. Molina, R.A. Saravanan, C.G. Cordovilla, E. Louis, and J. Narciso, Acta Mater. 51, 3145 (2003).

4. M. Schobel, H.P. Degischer, S. Vaucher, M. Hofmann, and P. Cloetens, Acta Mater. 58, 6421 (2010).

5. P.W. Ruch, O. Beffort, S. Kleiner, L. Weber, and P.J. Uggowitzer, Compos. Sci. Technol. 66, 2677 (2006).

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1. Effect of hot forging temperature and diamond volume fraction on TiC interface evolution and thermal conductivity of hot-forged Ti-coated diamond/Cu composites;Diamond and Related Materials;2024-06

2. Effects of Cu, Cu ₃ Sn, Cu ₆ Sn ₅ on Interfacial Properties between Cu–Sn Alloys and Diamond;physica status solidi (RRL) – Rapid Research Letters;2022-04-26

3. Interface manipulation and its effects on the resultant thermal conductivity of hot-forged copper/Ti-coated diamond composites;Journal of Alloys and Compounds;2021-07

4. Wetting mechanism of Cu3Ni, Cu3Zn, Cu3Sn on diamond surface: A first-principles calculation;Physica B: Condensed Matter;2021-07

5. Full density graphite/copper-alloy matrix composite fabricated via hot powder forging for pantograph slide;Materials Research Express;2021-06-01

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