Author:
Roy Nilabh K.,Behera Dipankar,Dibua Obehi G.,Foong Chee S.,Cullinan Michael
Funder
NXP Semiconductors
National Science Foundation
Publisher
Springer Science and Business Media LLC
Subject
General Engineering,General Materials Science
Reference18 articles.
1. D. Espalin, D.W. Muse, E. MacDonald, and R.B. Wicker, Int. J. Adv. Manuf. Technol. 72, 963 (2014).
2. J. Hoerber, J. Glasschroeder, M. Pfeffer, J. Schilp, M. Zaeh, and J. Franke, Procedia CIRP 17, 806 (2014).
3. N. Roy, A. Yuksel, and M. Cullinan, ASME 2016 11th International Manufacturing Science and Engineering Conference, 3, V003T08A002 (2016).
4. M. Vaezi, H. Seitz, and S. Yang, Int. J. Adv. Manuf. Technol. 67, 1721 (2013).
5. L. Hahn, P. Meyer, K. Bade, H. Hein, J. Schulz, B. Löchel, H.U. Scheunemann, D. Schondelmaier, and L. Singleton, Microsyst. Technol. 11, 240 (2005).
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