The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging-Reference-Cited by-同舟云学术

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The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging

Published:2006-06 Issue:6 Volume:58 Page:67-74
ISSN:1047-4838
Container-title:JOM
language:en
Short-container-title:JOM

Author:

Deppisch Carl,Fitzgerald Thomas,Raman Arun,Hua Fay,Zhang Charles,Liu Pilin,Miller Mikel

Publisher

Springer Science and Business Media LLC

Subject

General Engineering,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/s11837-006-0186-6.pdf

Reference9 articles.

1. P. Brandenburger et al., IATTJ, 3 (2000), pp. 331–343.

2. A. Dani et al., IATTJ, 4 (2001), pp. 265–277.

3. F. Hua and C. Deppisch, Journal of Surface Mount Technology, 19 (2006), pp. 21–26.

4. F.S. Shieu et al., Thin Solid Films, 346 (1999), pp. 125–129.

5. D.R. Frear and F.G. Yost, MRS Bulletin, December (1993), pp. 49–54.

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