Tin whiskers: An illustrated guide to growth mechanisms and morphologies-Reference-Cited by-同舟云学术

Tin whiskers: An illustrated guide to growth mechanisms and morphologies

Published:2011-10 Issue:10 Volume:63 Page:57-60
ISSN:1047-4838
Container-title:JOM
language:en
Short-container-title:JOM

Author:

Osenbach J. W.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/s11837-011-0177-0.pdf

Reference12 articles.

1. M. Warwick, J. Surface-Mount Technol., 12 (October 1000), pp. 14–19.

2. Y. Zang, CircuitTree (November 1999), pp. 28–33.

3. G.T. Galyon, IEEE Trans. Electron. Packag. Manuf., 28 (2005), p. 94.

4. P. Bush, G.L. Jones, and I. Boguslavasky, “Recrystallization Principles Applied to Whisker Growth in Tin,” (paper presented at the NEMI Workshop on Tin Whiskers, APEX 2003, Anaheim, CA, 1 April 2003).

5. J.W. Osenbach, R.L. Shook, B.T. Vaccaro, B.D. Potteiger, A.N. Amin, K.N. Hooghan, S. Suratkar, and P. Ruengsinsub, IEEE Trans. Electron. Packag. Manuf., 28(1) (2005), pp. 36–62.

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