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2. COST ACTION MP0602, Memorandum of Understanding for the Implementation of a European Concerted Research Action, “Advanced Solder Materials for High-Temperature Application,” Brussels (5 December 2006).
3. V. Chidambaram, J. Hald, and J. Hattel, “Development of High Melting Point, Environmentally Friendly Solders, Using the CALPHAD Approach” (Presentation at 2008 TOFA Conf., Krakow, Poland, 22–27 June 2008).
4. Morten S. Jellesen et al., “Corrosion in Electronics” (Paper presented at 2008 Eurocorr Conference, Edinburgh, Scotland, 7–11 September 2008).
5. R. Baboian, “Electronics,” Corrosion Tests and Standards: Applications and Interpretation, ed. R. Baboian (West Conshohocken, PA: ASTM, 1996), www.corrosionsource.com/events/intercorr/baboian.htm.