Finite element modeling of hydrostatic stress distribution in copper dual-damascene interconnects
Author:
Publisher
Springer Science and Business Media LLC
Subject
Multidisciplinary
Link
http://link.springer.com/content/pdf/10.1007/s12204-011-1148-x.pdf
Reference16 articles.
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3. Ang D, Wong C C, Ramaujan R V. The effect of aspect ratio scaling on hydrostatic stress in passivated interconnects [J]. Thin Soild Films, 2007, 515(6): 3246–3252.
4. Jones R E, Basehore M L. Stress analysis of encapsulated fine-line aluminum interconnects [J]. Applied Physics Letters, 1987, 50(12): 725–727.
5. Gouldstone A, Shen Y L, Suresh S, et al. Evolution of stresses in passivated and unpassivated metal interconnects [J]. Journal of Materials Research Society, 1998, 13(7): 1956–1966.
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