1. U. G�sele. T. Abe, J. Haisma, M. A. Schmidt (eds.),Semiconductor Wafer Bonding: Science, Technology, and Applications, Proceedings Vol. 92?97, The Electrochemical Society, Pennington, 1992.
2. M. A. Schmidt, T. Abe, C. E. Hunt, H. Baumgart (eds.),Semiconductor Wafer Bonding: Science, Technology, and Applications, Proceedings Vol. 93?129, The Electrochemical Society, Pennington, 1993.
3. D. Feijoo, Y. J. Chabal, S. B. Christman,Appl. Phys. Lett. 1994,65, 2548.
4. M. Reiche, S. Hopfe, U. G�sele, Q. Y. Tong,Appl. Phys. 1995,A61, 101.
5. N. J. Harrick,Internal Reflection Spectroscopy, Harrick Scientific Corporation, Ossining, 1987.