The microstructure and shear behavior of Zn–25Sn–xTi solder joints with Ni substrate-Reference-Cited by-同舟云学术

The microstructure and shear behavior of Zn–25Sn–xTi solder joints with Ni substrate

Published:2019-06-13 Issue:14 Volume:30 Page:13090-13098
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Chang Che-Wei^ORCID,Lin Kwang-Lung

Funder

Ministry of Science and Technology, Taiwan

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s10854-019-01672-8.pdf

Reference35 articles.

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3. Directive 2002/95/EC of the European Parliament and of the Council on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment

4. N.I. Sax, R.J. Lewis Sr., Dangerous Properties of Industrial Materials, 7th edn. (Van Nostrand Reinhold, New York, 1989), p. 2067

5. G. Zeng, S. McDonald, K. Nogita, Microelectron. Reliab. 52, 1306 (2012)

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