Funder
The National Key Research and Development Program of China
Beijing Young Top-Notch Talent Support Program
Beijing Science and Technology Plan
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference22 articles.
1. R.K. Ulrich, W. Brown, Advanced Electronic Packaging (Wiley-IEEE Press, Hoboken, 2006), pp. 76–87
2. R. R. Tummala, Shenzhen, International Conference on Electronics Packaging Technology (2005), pp. 393–396.
3. Q. Zhou, B.T. Zhou, T.K. Lee, T. Bieler, J. Electron. Mater. 45, 3013 (2016)
4. H. Hsu, T.Y. Lin, F.Y. Ouyang, J. Electron. Mater. 43, 236 (2014)
5. X.Q. Shi, Z.P. Wang, Q.J. Yang, H.L.J. Pang, J. Eng. Mater. Technol. 125, 81 (2002)
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献