A novel silver–aluminium high-temperature die attach nanopaste system: the effects of organic additives content on post-sintered attributes-Reference-Cited by-同舟云学术

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A novel silver–aluminium high-temperature die attach nanopaste system: the effects of organic additives content on post-sintered attributes

Published:2013-03-01 Issue:8 Volume:24 Page:2678-2688
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Manikam Vemal Raja,Razak Khairunisak Abdul,Cheong Kuan Yew

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s10854-013-1155-9.pdf

Reference77 articles.

1. V.R. Manikam, K.Y. Cheong, IEEE Trans. Compon. Packag. Technol. 1, 457 (2011)

2. H.S. Chin, K.Y. Cheong, A.B. Ismail, Met. Mat. Trans. B 41, 824 (2010)

3. J. Homberger, A.B. Lostetter, K.J. Olejniczak, T. McNutt, S.M. Lal, A. Mantooth, Proc. IEEE Aerosp. Conf. 4, 2538 (2004)

4. J.N. Lalena, N.F. Dean, M.W. Weiser, in Proc. Honeywell Electron. Mater. 131th Annu. TMS Meet Exhibit., 1 (2002)

5. A. Hartnett, S. Buerki, in Proc. 42nd IMAPS, 281 (2009)

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