The Preparation of Ag Nanopaste with Silver-Plated Diamond by Low-Temperature Pressureless Sintering
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Published:2021-06-01
Issue:6
Volume:16
Page:933-940
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ISSN:1555-130X
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Container-title:Journal of Nanoelectronics and Optoelectronics
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language:en
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Short-container-title:Journal of Nanoelectronics and Optoelectronics
Author:
Tang Rongjiang1,
He Hong1,
Jiang Xiong1,
Zeng Fabing1,
Yan Haidong1,
Zhang Ping1
Affiliation:
1. School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, 541004, China
Abstract
Diamond/Ag nanopaste has been prepared by mixing Ag nanoparticles, silver-plated diamond particles, and an organic solvent system. Then, we characterized and studied the sintering properties of diamond/Ag nanopaste. Meanwhile, the impact factor of sintering temperature on the sintered
microstructure of the diamond/Ag nanopaste on direct bonding copper (DBC) substrate was investigated. The influences of sintering temperature on the shear strength of diamond/Ag nanopaste connection layer for attaching silicon chip on the silver-plated copper substrate were analyzed. The results
show that silver plating on the surface of the diamond can significantly strengthen the bonding ability between the diamond and nano-silver. When the pressureless sintering temperature increased from 150 °C to 350 °C, the porosity of diamond/Ag nanopaste decreased from 29.8% to 8.9%,
and the sintered diamond/Ag joint with uniform and dense connection layer showed the maximum shear strength of 15.26 MPa as sintering at 350 °C.
Publisher
American Scientific Publishers
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials