Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference27 articles.
1. T.L. Yang, J.Y. Wu, C.C. Li, S. Yang, C.R. Kao, Low temperature bonding for high temperature applications by using SnBi solders. J. Alloys Compd. 647, 681–685 (2015)
2. C.K. Chung, Y.J. Chen, C.C. Li, C.R. Kao, The critical oxide thickness for Pb-free reflow soldering on Cu substrate. Thin Solid Films 520(16), 5346–5352 (2012)
3. L. Zhang, L. Sun, Y.H. Guo, Microstructures and properties of Sn58Bi, Sn35Bi0.3Ag, Sn35Bi1.0Ag solder and solder joints. J. Mater. Sci. 26(10), 7629–7634 (2015)
4. Y.J. Hu, Y.C. Hsu, C.T. Lu, T.S. Huang, C.Y. Chen, W.N. Chuang, C.Y. Hsiao, C.P. Lin, C.Y. Liu, Interfacial reactions between columnar or layered Ni(P) layers and Sn–Ag–Cu solder. J. Electron. Mater. 43(1), 277–283 (2014)
5. B. Horvath, B. Illes, T. Shinohara, Growth of intermetallics between Sn/Ni/Cu, Sn/Ag/Cu and Sn/Cu layered structures. Thin Solid Films 556, 345–353 (2014)
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