Author:
Hu Bo,Yang Fan,Peng Ye,Ji Hongjun,Yang Shihua,Yang Ming,Li Mingyu
Funder
The Shenzhen Special Funds for Strategic Emerging Industries Grant
The Innovation Foundation of Shanghai Aerospace Science and Technology
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference19 articles.
1. K. Ma, M. Liserre, F. Blaabjerg, T. Kerekes, Thermal loading and lifetime estimation for power device considering mission profiles in wind power converter. IEEE Trans. Power Electron. 30, 590–602 (2014)
2. W. Zhou, X. Zhong, K. Sheng, High temperature stability and the performance degradation of SiC mosfets. IEEE Trans. Power Electron. 29, 2329–2337 (2014)
3. Y.C. Liu, J.W.R. Teo, S.K. Tung, K.H. Lam, High-temperature creep and hardness of eutectic 80Au/20Sn solder. J. Alloys Compd. 44, 8340–343 (2008)
4. S. Kim, K.S. Kim, S.S. Kim, K. Suganuma, Interfacial reaction and die attach properties of Zn-Sn high-temperature solders. J. Electron. Mater. 38, 266–272 (2009)
5. E. Lugscheider, S. Ferrara, Characterisation and optimisation of innovative solders for transient liquid phase bonding and active soldering. Adv. Eng. Mater. 6, 160–163 (2004)
Cited by
6 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献