Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics

Published:2015-09-02 Issue:1 Volume:27 Page:23-32
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Conseil Hélène,Verdingovas Vadimas,Jellesen Morten S.,Ambat Rajan

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s10854-015-3712-x.pdf

Reference31 articles.

1. T. Munson, Foresite Inc., www.residues.com . Accessed 02 July 2014

2. M.L. Minges, Electronic Materials Handbook, vol. 11, 1st edn. (ASM International, Almere, 1989)

3. J.H. Lau, Solder Joint Reliability (Springer, Van Nostrand Reinhold, 1991)

4. P. Biocca (2001) in Proceedings of Surface Mount Technology Association (SMTA International) 2001, Chicago, Illinois, 30 Sept to 4 Oct 2001

5. U. Rathinavelu, M.S. Jellesen, P. Møller, R. Ambat, IEEE Trans. Compon. Package Technol. 2(4), 719–728 (2012)

Cited by 32 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Wettability in lead-free soldering: Effect of plasma treatment in dependence on flux type;Applied Surface Science;2024-09

2. Study of Interaction Between Reflow Solder Flux and Humidity in Relation to Failures in Electronics;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-03

3. Review—Electrochemical Migration in Electronic Materials: Factors Affecting the Mechanism and Recent Strategies for Inhibition;Journal of The Electrochemical Society;2023-02-01

4. The effect of solvents on thermal stability of solder pastes in reflow process;Journal of Materials Science;2023-01-18

5. Effects of Concentration of Adipic Acid on the Electrochemical Migration of Tin for Printed Circuit Board Assembly;Journal of Electronic Materials;2023-01-12

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3