Funder
national natural science foundation of china
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference41 articles.
1. E.P. Wood, K.L. Nimmo, In search of new lead-free electronic solders. J. Electron Mater. 23, 709–713 (1994)
2. Y. Zhong, W. Liu, C.Q. Wang, X.J. Zhao, J.F.J.M. Caers, The influence of strengthening and recrystallization to the cracking behavior of Ni, Sb, Bi alloyed SnAgCu solder during thermal cycling. Mater. Sci. Eng. A. 652, 264–270 (2016)
3. K.M. Kumar, V. Kripesh, A.A.O. Tay, Single-wall carbon nanotube (SWCNT) functionalized Sn-Ag-Cu lead-free composite solders. J. Alloys Compd. 450, 229–237 (2008)
4. H.X. Xie, L. Jing, N. Chawla, Effect of cerium addition on wetting, undercooling, and mechanical properties of Sn-3.9Ag-0.7Cu Pb-free solder alloys. J. Mater. Sci.: Mater. Electron. 24, 3456–3466 (2013)
5. Y. Wang, X.C. Zhao, Y. Liu, Y. Wang, D.M. Li, Microstructure, wetting property of Sn–Ag–Cu–Bi–xCe solder and IMC growth at solder/Cu interface duringthermal cycling. Rare Met. 40, 714–719 (2021)
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献