Effect of Ni content on the creep properties of Cu/Sn–0.3Ag–0.7Cu/Cu solder micro-joints-Reference-Cited by-同舟云学术

Effect of Ni content on the creep properties of Cu/Sn–0.3Ag–0.7Cu/Cu solder micro-joints

Published:2020-02-21 Issue:7 Volume:31 Page:5462-5470
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Yao Zongxiang,Ling Diying,Yin Limeng^ORCID,Wang Gang,Zhang Hehe,Jiang Shan

Funder

the National Natural Science Foundation of China

Natural Science Foundation of Chongqin

National Innovation Training Program for College Students

the Program for Creative Research Groups in University of Chongqing

Chongqing Technology Innovation and Application Demonstration project

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s10854-020-03109-z.pdf

Reference18 articles.

1. Y. Zhu, F.L. Sun, Geometric size effect on IMC growth and elements diffusion of Cu/Sn/Cu solder joints. Solder. Surf. Mount Technol. 29(2), 85–91 (2017)

2. L. Zhang, Z.Q. Liu, Inhibition of intermetallic compounds growth at Sn-58Bi/Cu interface bearing CuZnAl memory particles (2–6 μm). J. Mater. Sci. 31, 2466–2480 (2020)

3. L.M. Yin, S. Wei, Z. Xu et al., The effect of joint size on the creep properties of microscale lead-free solder joints at elevated temperatures. J. Mater. Sci. 24(4), 1369–1374 (2013)

4. K. Lee, J.W. Morris, F. Hua, Mechanisms of creep deformation in pure Sn solder joints. J. Electron. Mater. 42(3), 516–526 (2013)

5. L.M. Yin, M. Pecht, S. Wei, Y.F. Geng, Z.X. Yao, Effect of joint height on the mechanical behaviors of micro-scale solder joints. Trans. China Weld. Inst. 34(8), 27–30 (2013)

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1. Effect of Ni-RGO nanosheets on the creep behavior of Sn–Ag–Cu composite solder joints;Materials Chemistry and Physics;2024-10

2. Melting Characteristic, Wettability, Interfacial Reaction, and Shear Property of Ball Grid Array Structure Cu/Sn_0.3Ag_0.7Cu/Cu Solder Joints With Ni-Modified Carbon Nanotubes;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-08

3. Thermal, Microstructural, and Mechanical Features of Bi-Containing Sn-1Ag-0.5Cu Lead-Free Solders;Journal of Electronic Materials;2023-04-27

4. Effects of Graphene Nanosheets on the Wettability and Mechanical Properties of Sn-0.3Ag-0.7Cu Lead-Free Solder;Journal of Electronic Materials;2020-10-19