Thermoelectric analysis of (Bi0.98In0.02)2Te2.7Se0.3/polyaniline and (Bi0.98In0.02)2Se2.7Te0.3/polyaniline composites

Abstract

AbstractThe present study examines the thermoelectric (TE) properties of Polyaniline (PANI) in (Bi0.98In0.02)2Te2.7Se0.3 (BIT) and (Bi0.98In0.02)2Se2.7Te0.3 (BIS), compounds created using solid-state reaction in the temperature interval 10 to 350 K. The XRD study reveals hexagonal crystal structure with a space group of $$R\stackrel{-}{3}m$$ R 3 - m . The composite samples have grains that resemble hair like structure because size of the grains above the surfaces has expanded irregularly, and selenium has been shown to concentrate at the grain borders. Electrical resistivity in BIS/PANI has found decreased by 6 times compared to BIT/PANI. The decrease in overall thermal conductivity is strongly influenced by the interface scattering effect of PANI composites and the BIT/BIS grain boundaries. The thermal conductivity of pure BIT is found to decrease by 1.5 and 1.4 times, respectively, than that of BIT/PANI and BIS/PANI. In comparison to pure BIT and BIS samples, the ZT value of BIT/PANI has been raised by a factor of 20.