Funder
Scientific Research Foundation of Changzhou Vocational Institute of Engineering
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference19 articles.
1. Y. Wang, Y. Wang, J.J. Chen et al., A facile process combined with inkjet printing, surface modification and electroless deposition to fabricate adhesion-enhanced copper patterns on flexible polymer substrates for functional flexible electronics. Electrochim. Acta 218, 24–31 (2016)
2. Y. Wang, G. Hong, J. Chen et al., Paper-based inkjet-printed flexible electronic circuits. ACS Appl. Mater. Interfaces 8, 26112–26118 (2016)
3. Y. Wang, L. Ni, F. Yang et al., Facile preparation of high-quality copper layer on epoxy resin via electroless plating for applications in electromagnetic interference shielding. J. Mater. Chem. C 5, 12769–12776 (2017)
4. Y. Zhang, C. Liu, D.C. Whalley, The penetration limit of poly(4-vinyl phenol) thin films for etching via holes by inkjet printing. Appl. Phys. Lett. 101, 253302 (2012)
5. Z.P. Sun, J.J. Huang, L.B. Wang, X.C. Zhang, M.L. Li, B. Tang, Method for electroless nickel plating on poly(ethylene terephthalate) substrate modified with primer and self-assembled monolayer. Mater. Sci.: Mater. Electron. 26, 10132–10137 (2015)