Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference36 articles.
1. M. Yunus et al., Effect of voids on the reliability of BGA/CSP solder joints. Microelectron. Reliab. 43(12), 2077–2086 (2003)
2. S.K. Kang, A.K. Sarkhel, Lead (Pb)-free solders for electronic packaging. J. Electron. Mater. 23(8), 701–707 (1994)
3. S. Menon et al., High lead solder (over 85%) solder in the electronics industry: RoHS exemptions and alternatives. J. Mater. Sci. 26(6), 4021–4030 (2015)
4. E. Ringgaard, T. Wurlitzer, Lead-free piezoceramics based on alkali niobates. J. Eur. Ceram. Soc. 25(12), 2701–2706 (2005)
5. L.-H. Su et al., Interfacial reactions in molten Sn/Cu and molten In/Cu couples. Metall. Mater. Trans. B 28(5), 927–934 (1997)
Cited by
11 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献