Structural influence of copper substrate on magnetic properties of electrodeposited CoPtP films for MEMS applications-Reference-Cited by-同舟云学术

Structural influence of copper substrate on magnetic properties of electrodeposited CoPtP films for MEMS applications

Published:2015-08-20 Issue:12 Volume:26 Page:9821-9826
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Manimaran Ezhil Inban,Navaneetha Emerson Rajamony

Funder

University Grants Commission (IN)

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s10854-015-3655-2.pdf

Reference15 articles.

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2. P.C. Andricacos, N. Bobertson, IBM J. Res. Dev. 42(5), 671–680 (1998)

3. H.J. Cho, C.H. Ahn, IEEE Trans. Magn. 36, 686 (2000)

4. K.H. Lee, G.H. kim, W.Y. Jeung, Electrochem. Commun. 4, 605 (2002)

5. O. Cugat, J. Delamare, G. Reyne, IEEE Trans. Magn. 39, 3607 (2003)

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