A study on the 50 μm fine pitch Flex-on-Flex (FOF) assembly using conventional and nanofiber anisotropic conductive films (ACFs)
Author:
Funder
National Natural Science Foundation of China
Shenzhen Science and Technology Program
Shenzhen Advanced Technology Research Institute Outstanding Youth Innovation Fund Youth Cultivation Project
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s10854-024-12104-7.pdf
Reference11 articles.
1. S.H. Lee, K.L. Suk, K. Lee et al., Study on fine pitch flex-on-flex assembly using nanofiber/solder anisotropic conductive film and ultrasonic bonding method. IEEE Trans. Compon. Packag. Manuf. Technol. 2(12), 2108–2114 (2012)
2. T.W. Kim, K.L. Suk, S.H. Lee et al., Low temperature flex-on-flex assembly using polyvinylidene fluoride nanofiber incorporated Sn58Bi solder anisotropic conductive films and vertical ultrasonic bonding. J. Nanomater. 2013, 7 (2013)
3. T.W. Kim, T.I. Lee, Y. Pan et al., Effect of nanofiber orientation on nanofiber solder anisotropic conductive films joint properties and bending reliability of flex-on-flex assembly. IEEE Trans. Compon. Packag. Manuf Technol. 6(9), 1317–1329 (2016)
4. Y.C. Lin, J. Zhong, A review of the influencing factors on anisotropic conductive adhesives joining technology in electrical applications. J. Mater. Sci. 43(9), 3072–3093 (2008)
5. X. Chen, J. Zhang, C. Jiao et al., Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection. Microelectron. Reliab. 46(5), 774–785 (2006)
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