Author:
Chen Xu,Zhang Jun,Jiao Chunlei,Liu Yanmin
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference21 articles.
1. Anisotropic conductive film interconnection for display packaging applications;Yim;IEEE Trans Compon Electron Technol,1998
2. Design and understanding of anisotropic conductive films (ACFs) for LCD packaging;Yim;IEEE Trans Compon Pack Manuf Technol Part A,1998
3. Flip chip interconnect using anisotropic conductive adhesive;Sarkar;J Mater Process Technol,1999
4. Nagai A, Takemura K, Kazuhiro. Anisotropic conductive adhesive films for flip-chip interconnection onto organic substrates. In: 1998 Proceedings of the IEMT/IMCP, 1998. p. 353–7.
5. Reliability of anisotropically conductive adhesive joints on a flip-chip/FR 4 substrate;Liu;ASME Trans J Electron Pack,2002
Cited by
38 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献