Electrochemical characterization of Cu dissolution and chemical mechanical polishing in ammonium hydroxide–hydrogen peroxide based slurries
Author:
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrochemistry,General Chemical Engineering
Link
http://link.springer.com/content/pdf/10.1007/s10800-009-0055-4.pdf
Reference46 articles.
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4. Oliver MR (2004) In: Oliver MR (ed) Chemical-mechanical planarization of semiconductor materials. Springer, Berlin
5. Luo D, Campbell DR, Babu SV (1997) Thin Solid Films 311:177
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