The shape evolution and application studies of electrodeposited bumps in electroforming-Reference-Cited by-同舟云学术

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The shape evolution and application studies of electrodeposited bumps in electroforming

Published:2018-05-15 Issue:7 Volume:48 Page:819-826
ISSN:0021-891X
Container-title:Journal of Applied Electrochemistry
language:en
Short-container-title:J Appl Electrochem

Author:

Gu Huayu,Sun Hao,Xiong Ying,Liu Gang,Wang Xiang

Funder

Natural Science Foundation of Anhui Province

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrochemistry,General Chemical Engineering

Link

http://link.springer.com/article/10.1007/s10800-018-1203-5/fulltext.html

Reference18 articles.

1. Yang JJ, Miao F, Pickett MD, Ohlberg DAA, Stewart DR, Lau CN, Williams RS (2009) The mechanism of electroforming of metal oxide memristive switches. Nanotechnology. https://doi.org/10.1088/0957-4484/20/21/215201

2. Kamyabi MA, Hajari N (2016) Preparation of mesoporous silica templated metal nanostructure on Ni foam substrate and its application for the determination of hydrogen peroxide. J Appl Electrochem 46(9):951–962. https://doi.org/10.1007/s10800-016-0986-5

3. Jung DH, Sharma A, Kim KH, Choo YC, Jung JP (2015) Effect of current density and plating time on cu electroplating in TSV and low alpha solder bumping. J Mater Eng Perform 24(3):1107–1115. https://doi.org/10.1007/s11665-015-1394-4

4. Hreid T, O’Mullane AP, Spratt HJ, Will G, Wang HX (2016) Investigation of the electrochemical growth of a Cu-Zn-Sn film on a molybdenum substrate using a citrate solution. J Appl Electrochem 46(7):769–778. https://doi.org/10.1007/s10800-016-0967-8

5. Kondo K, Suzuki Y, Saito T, Okamoto N, Koyama Y (2009) Shape evolution of electrodeposited bumps with shallow and deep cavities. J Electrochem Soc 156(12):D548-D552. https://doi.org/10.1149/1.3232014

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Transient Simulation of Diffusion-Limited Electrodeposition Using Volume of Fluid (VOF) Method;Journal of The Electrochemical Society;2023-07-01

2. Electroforming in the Industry 4.0 Era;Current Opinion in Electrochemistry;2020-04

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