Novel Chemical Mechanical Polishing/Plasma-Chemical Vaporization Machining (CMP/P-CVM) Combined Processing of Hard-to-Process Crystals Based on Innovative Concepts
Author:
Publisher
MYU K.K.
Subject
General Materials Science,Instrumentation
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Recent Trends in Polishing Processes for Advanced Power Semiconductors;Journal of the Japan Society for Precision Engineering;2023-05-05
2. Next Generation CMP Process Technique for Hard-to-Process Single Crystals;Journal of the Japan Society for Precision Engineering;2022-06-05
3. Approaches to Sustainability in Chemical Mechanical Polishing (CMP): A Review;International Journal of Precision Engineering and Manufacturing-Green Technology;2021-11-26
4. Rapid Estimation of Removal Rate of Chemical Mechanical Polishing of Gallium Nitride Substrate by Quantitative Diagnosis of Cathodoluminescence Images;ECS Journal of Solid State Science and Technology;2021-10-01
5. Study of Femtosecond Laser Ablation Effect on Micro-Processing for 4H-SiC Substrate;International Journal of Automation Technology;2018-03-01
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