Accuracy of Multiple Micro-Holes Pierced by Press Indenting and Chemical Etching
Author:
Affiliation:
1. Department of Materials Science and Engineering, Kyushu Institute of Technology
2. Graduate School of Engineering, Kyushu Institute of Technology
Publisher
Japan Society of Mechanical Engineers
Link
https://www.jstage.jst.go.jp/article/jmmp/7/2/7_217/_pdf
Reference7 articles.
1. (1) Low D.K.Y, Li L., Corfe A. G. and Byrd P. J., Spatter-free laser percussion drilling of closely spaced array holes, International Journal of Machine Tools & Manufacture, Vol. 41 (2001), pp.361-377.
2. (2) Chern G. and Wang S., Punching of Noncircular Micro-holes and Development of Micro-forming, Precision Engineering, Vol. 31 (2007), pp.210-217.
3. (3) Diver C., Atkinson J., Helml H.J. and Li L., Micro-EDM drilling of tapered holes for industrial applications, Journal of Materials Processing Technology, Vol. 149 (2004), pp.296-303.
4. (4) Fujino M., Yamamoto M., Masuzawa T., Micro-punching System as an Application of WEDG, SEISAN KENKYU, Vol.39-No.6 (1987), pp.277-280. (In Japanese)
5. (5) Egashira K. and Mizutani K. ,Micro-drilling of Monocrystalline Silicon Using a Cutting Tool, Precision Engineering, Vol. 26 (2002), pp.263-268.
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